SBC-TI22

SBC-TI22 is the motherboard of Tensor-I22.

It is based on Intel Core i5 or i7, Gen. 11 Tiger Lake – UP3 processor.

SBC-TI22 is accompanied by EB-TI22A, a back-panel interface module.

Including 4 expansion interfaces for use by Tensor TEL modules, it can be customised for various applications, including industrial automation, AI edge computing, robotics control, network security and monitoring, retail, media, and more.

Main features

  • Intel® Tiger Lake 11th Generation Coreâ„¢ processor
  • Up to 4 x Gigabit Ethernet ports
  • Up to 3 x NVMe/SATA storage devices
  • Up to 12 x USB 3.1 / 2.0 ports
  • Optional Wi-Fi/BT + LTE/5G modem
  • Up to 12 x RS-232 / RS-485 or 40+ isolated GPIOs
  • 12V-56V DC power input
  • Size with EB:  147 x 166 mm
  • 5-year warranty

The added value

Long-term availability with an extra-long warranty

C-LAB’s computers and modules are guaranteed to be available for at least 15 years from platform launch.
With this longevity, you can count on us for the long run.

Proud of our products, we provide a 5-year warranty as standard, reinforcing our commitment to guaranteeing quality and customer satisfaction over time.

Full-scale customisation

C-LAB offers a wide range of special customisation services so that the computers units can be shipped ready-to-use and according to customer’s needs:

  • SMT-level hardware configuration
  • Custom operation system imaging
  • Customised BIOS menu default options
  • Branding: custom splash screen, company logo, documentation, labelling and packaging
  • ZTP (Zero-Touch Provisioning)

Direct engineering support

From pre-sale consultations to post-sale engineering support, direct technical assistance is provided by the product’s development engineers. This streamlined support system ensures efficient and effective resolution of technical challenges, enhancing the customer’s project design flow.

Specifications

CPU

Intel 11th Gen. Core SoC (Tiger Lake – UP3):

  • Intel Core i7-1185G7E (4 Core, 8 Threads | Base: 1.8/2.8 GHz, Boost: 4.4 GHz | 12 MB Cache | TDP: 15/28 W1)
  • Intel Core i5-1145G7E (4 Core, 8 Threads | Base: 1.5/2.6 GHz, Boost: 4.1 GHz | 8 MB Cache | TDP: 15/28 W1)
  • Intel Celeron 6305E (2 Cores, 2 Threads | Base: 1.8 GHz | 4 MB Cache | TDP: 15 W)

CPU frequency is preset to match cooling capacity and target case temperature.
Owner can adjust this setting in BIOS.
1 For 28W CPU operation, EW30-ECR20 housing is recommended (300 x 200 x 45.3 mm)

Memory

Up to 64GB, 2 x SO-DIMM DDR4, up to 3200MT/s

Display

4 independent displays

2 x HDMI 1.4b (up to 3840 x 2160 @ 30Hz)

2 x mini-DP 1.2 (up to 4096 x 2160 @ 60Hz) Dual mode

Storage

Up to 3 storage devices

On-board: M.2 key-M NVMe PCIe x4 or SATA, up to 2280

  • Optional FT.F-M2NVME: additional NVMe / SATA on M.2 Key-M
  • Optional FT.T-SATA1: additional 2.5″ SATA SSD/HDD

Networking and Wireless

LAN

On-board: dual Gbit Ethernet (Intel I219 + Intel I210)

  • Optional FT.C-LAN2: additional 2 x 1 Gigabit Ethernet on RJ45
  • Optional FT.CB-LAN10G2: additional 2 x 10 Gigabit Ethernet on RJ45
  • Optional FT.W-OPLN2: additional 2 x 1 Gigabit Ethernet on SFP+ for optical LAN
  • Optional FT.U-POE2: additional 2 x 1 Gigabit Ethernet on RJ45 with PoE source, up to 15W each

Wireless LAN Wi-Fi 6E + BT 5.2

M.2 Key-E for Wi-Fi/BT module

Cellular communication LTE/4G

M.2 Key-B for LTE/5G modem
On-board Nano-SIM socket.

I/O

USB

On-board: 4 x USB type-A (2x USB 3.1 + 2x USB 2.0)
  • Optional FT.ED-USB3PCIV4: Up to 8 x additional USB 3.1 on USB Type-A
  • Optional FT.EC-USB2V4: Up to 8 x additional USB 2.0 on USB Type-A

Audio

On-board: Audio over HDMI and DP

Optional analog output, analog input on 3.5 mm jacks

Serial port / GPIO / CAN bus

Multiple Serial ports and GPIOs can be added to Tensor-I22 using TEL extension modules:

  • Up to 20 isolated RS-232 / RS-485 on DB9
  • Up to 40 isolated GPIOs on terminal blocks
  • Up to 9 isolated CAN bus ports on DB9

TPM

Trusted Plaftorm Module

On-board: Intel PTT

Optional TPM 2.0 on a discrete module

Extensions TEL modules

Tensor-I22 has a wide range of common interfaces on the back panel module and on the motherboard. Using TEL extension modules, additional interfaces can be installed to adjust the Tensor-I22 to any application. 

* The TELs are connected to the SBC-TI22 using a soft connection, so need an additional mounting solution.

Contact us for additional details about possible extension TEL module combinations.

Technical Documentation

Download PDFSBC-TI22 Datasheet

 

For more technical information, go to C-LAB Technical Wiki

B2B Benefits

  • Direct support from the product’s hardware, software and mechanical engineers
  • Extended services – OEM branding, hardware and software customisation, software imaging
  • Product life-cycle management – revision freezing, advanced notice on engineering changes, stocking of EOL components
  • Risk-free evaluation – Order for testing during an evaluation period of up to 45 days. If the product is unsatisfactory, return it for a full refund (subject to condition of device and excluding storage devices, OS license, and shipping costs).

Contact us

Please fill out the form below and C-LAB will get in touch to assist you in configuring and ordering the device you need according to your specific business requirements.

Contact Details

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Project and Requirements

Project Description

It's not mandatory, but anything you can tell us about your project can help us support you more effectively, eg. What industry/sector are you in? What is the intended application? What solution are you looking for? How many units are you planning to sell? When are you intending to start deployment? What is the predicted project longevity?

Major Requirements

Performance/CPU | RAM | Storage | I/O | Networking and Wireless | Display | environment | power | mounting...

Would you like an evaluation unit?

What should it include that would help the evaluation process?