Airtop3
Airtop3
Airtop3 is a ruggedised small form-factor fanless IoT Edge server with remarkable performance, features and cooling.
The ruggedised aluminium case is specially designed to generate natural airflow by the waste heat of the CPU and GPU which allows Airtop3 to dissipate up to 300W without using a fan, and operate at a wide range of temperatures.
Airtop3 has high RAM and storage capacity and plentiful networking and I/O ports. It is also modular and easy to service.
Main features
- Fanless cooling by Natural Airflow Technology
- up to Core i9 9900K 8-core CPU
- RTX 4060 or RTX A2000 graphic cards
- Up to 128 GB RAM and 6 storage devices
- Rich networking and I/O with support for extension cards
- Compact 7.5 litre all aluminium housing
- User-friendly industrial design with tool-free service
- Wide temperature range
- 5-year warranty
Performance
Airtop3 supports octa-core 9th generation Intel® Xeon® E Processors and Intel® Core™ i9 Processors, including the highest power 95W Xeon E 2288G / Core i9-9900K. The maximum RAM capacity is 128 GB DDR4-2666.
Storage is comprised of 6 devices – two NVMe SSDs – up to 2 TB each and four 2.5” SATA 3 HDD SSD with RAID support. For networking Airtop3 includes two GbE ports and support for Wi-Fi 802.11ac and 4G modem. I/O includes 3 x 4K displays, 6 x USB 3.1 ports, 3 x RS232 and audio.
This feature set may be satisfactory in some cases, but IoT has many specializsd applications – deep learning may require a discrete GPU, automotive applications often require high capacity of high speed storage, machine vision usually utilises integrated PoE ports.
For these use cases and other, Airtop3 offers functional enhancements.
Enhancements
Enhanced Graphics
Airtop3 has a PCIe x16 (PEG) slot with Natural Airflow passive cooling that supports up to 160W Quadro RTX 4060 graphics card. This powerful CPU + GPU setup is effective for low latency edge analytics workloads involving image recognition, machine learning or inferencing. The four displays of the graphics card can work in tandem with the integrated graphics for a total of seven 4K displays.
Enhanced Storage
The standard two NVMe cards and four 2.5” SATA SSD/HDD support up to 20 GB with RST or software RAID and are passively cooled in a dedicated thermal zone. Enhanced using Airtop3’s NVM3 card installed in the PEG slot. NVM3 supports additional three NVMe cards up to NF1 30110 form factor.
NVM3 enables remarkable data rate of over 9500 MBps and increases max storage capacity to over 60 TB. It allows installing SSDs with power loss protection (PLP).
Enhanced Networking
Dual Gbit Ethernet (Intel i210 + Intel i219) and optional 802.11ac + 4G/LTE modem are available as a standard. higher bandwidth, dual 10 GbE card can be installed in the PEG slot. Extra networking capabilities can be added using a FACE Module
- FM-LAN adds 4 independent GbE ports – useful for routing applications
- FM-PoE adds 4 GbE ports, each with 802.3af PoE source which simplifies setups involving IP cameras
- FM-OPLN adds 2 GbE SFP+ optical LAN ports which enables longer range, better immunity and higher security
Natural Airflow Technology
Natural Airflow (NAF) technology generates airflow without a fan.
The airflow is generated by the waste heat of the CPU and the GPU, and cools them down in the process.
Below is an explanation of the NAF elements:
- The CPU and GPU each are thermally coupled to a specially designed massive copper plate using best-in-class TIM. Each copper plate is CNC-machined and mirror-polished.
- Airtop3 uses high-performance flat heat pipes – with 25 channels each. Three such heat pipes are arranged in a criss-cross array and pressed together against the copper plate with direct large-area thermal coupling between them. This structure distributes heat evenly on the face of the air-tube panel. The thermal performance of the heat pipe structure is comparable to a chamber but on a much larger scale.
- The air-tube panel doubles the cooling efficiency of a conventional heatsink. It achieves that by utilising 14 air tubes, each air tube stimulates airflow by the stack effect. The air-tube panel is made of a single block of aluminium that undergoes multiple processing steps:
◦ State-of-the-art extrusion with 14 cavities
◦ Machining
◦ Multi-layer coating for optimal balance between heat dissipation and tactile temperature - The result is a compact, near-flat passive heat-exchange element that can dissipate up to 160W.
Durability
The 7.5 litre housing is all aluminium made of die-cast and extruded parts with precision machining for seamless fit, shock and vibration resistance. There are no moving parts in Airtop3 and no filters, so Airtop3 is maintenance free. Since no mechanical wearing is involved Airtop3 reliability is not reduced over time, therefore Airtop3 ships with a 5 year warranty. Natural Airflow cooling is effective at a wide range of temperatures. Airtop3 can be ordered with operating temperature range of -40ºC to 70ºC.
Modularity & Monitoring
Airtop3 supports Compulab FACE Modules (Function And Connectivity Extension Modules) which enable various application specific networking and I/O capabilities. The FMAT3 FACE module designed specifically for Airtop3 adds 2 x USB 3.1 gen 2 (one USB type-C) + 1 x USB 3.1 gen 1, front audio jacks, mini PCIe socket with SIM card, micro-SD and diagnostics LEDs for troubleshooting RAM, BIOS and display issues.
It is very easy to install RAM and storage devices in Airtop3 thanks to the clamshell tool-free opening. Airtop3 includes the I3M OLED display – for displaying vital runtime information including clock rate, temperature and power consumption.
The added value
Long-term availability with an extra-long warranty
C-LAB’s fanless industrial computers are guaranteed to be available for at least 15 years from platform
launch. With this longevity, you can count on us for the long run.
Proud of our products, we provide a 5-year warranty as standard, reinforcing our commitment to guaranteeing quality and customer satisfaction over time.
Full-scale customisation
C-LAB offers a wide range of special customisation services so that computers can be shipped ready-to-use and according to customer’s needs:
- SMT-level hardware configuration
- Custom operation system imaging
- Customised BIOS menu default options
- Branding: custom splash screen, company logo, documentation, labelling and packaging
- ZTP (Zero-Touch Provisioning)
Direct engineering support
From pre-sale consultations to post-sale engineering support, direct technical assistance is provided by the product’s development engineers. This streamlined support system ensures efficient and effective resolution of technical challenges, enhancing the customer’s project design flow.
CPU
Intel Xeon E-2278GE
Intel Xeon E-2176G
Intel Core i9-9900K
Intel Core i7-9700E
Intel Core i5-9500E
Intel Celeron G4900T
Compatible 9th generation Xeon E and Core processors.
Other compatible CPUs can be installed for volume orders.
See Airtop3 build-to-order for a complete list of available CPUs.
Chipset
Intel C246 Chipset
Storage
2 x NVMe
M.2 key M 2280 | 2260 | 2242 | 2230
PCIe x4
Note: One of the ports also supports SATA 3, 6 Gbps
4 x 2.5” HDD / SSD
4 x disks up to 9.5mm | 2 x 15mm disks
Optional NVM3 card with 3 x NVMe
3 x NVMe M.2 key M 2260 | 2280 | 22110
Networking
LAN
On-board: dual Gbit Ethernet (Intel I219 + Intel I210)
Optional FACE Module: 4 x GbE | 4 x GbE + PoE | 2 x optical LAN | Ethernet bypass
Wireless LAN* 802.11ac dual antenna + BT 4.2
Add-on M.2 key E 2230 + 2x RP-SMA antennas.
User can install another Wireless LAN adapter.
*Optional
Cellular communication* LTE/WCDMA/GSM/GNSS
Add-on M.2 key B 3042 + 2 x RP-SMA antennas
On-board micro-SIM socket.
*Optional
I/O
USB
6 x USB 3.1 gen 1 type-A on-board (back panel) by default (with FM-AT3 FACE Module, in front panel):
- 1 x USB 3.1 gen 2 type C
- 1 x USB 3.1 gen 2 type A
- 1 x USB 3.1 gen 1 type A
Audio
On-board Realtek ALC1150 audio codec with line-out | mic | optical S/PDIF By default (with FM-AT3 FACE Module, in front panel):
- Extra Realtek ALC1150 audio codec with headphones-out | mic Audio over HDMI | DP
3 x RS232 serial port
3 x full-UART Extra 6 serial ports available with optional FM-SER FACE Module
Extensions
FACE Module
(Function and Connectivity Extension Module)
PCIe x16 standard height single-slot
Used for discrete graphics card (GeForce or Quadro) / NVM3 card / 10 GbE card / another full-height PCIe card
M.2 key E
M.2 key B
+ micro-SIM socket
Normally used for optional WiFi and 4G card
TPM
Trusted Platform Module
On-board TPM 2.0 on a discrete module
B2B Benefits
- Direct support from the product’s hardware, software and mechanical engineers
- Extended services – OEM branding, hardware and software customisation, software imaging
- Product life-cycle management – revision freezing, advanced notice on engineering changes, stocking of EOL components
- Risk-free evaluation – Order for testing during an evaluation period of up to 45 days. If the product is unsatisfactory, return it for a full refund (subject to condition of device and excluding storage devices, OS license, and shipping costs).
Contact us
Please fill out the form below and C-LAB will get in touch to assist you in configuring and ordering the device you need according to your specific business requirements.
