fitlet3

fitlet3 is a miniature x86 industrial computer.  Optimized as industrial IoT gateway and edge computing alpplications. Its multiple connectivity options and industrial interfaces make it a very capable computer in a very small form factor. 

Various extension FACET modules give additional flexibility and allow fitlet3 to connect any industrial system, sensor or machine to the cloud.

fitlet3 is geat as an edge-AI device with a high-speed interface and enhanced heat dissipation for optional AI accelerators.

Main features

  • Intel® Elkhart Lake x6000E Atom processor
  • Up to 4 x Gigabit Ethernet ports
  • Up to 2 x NVMe/SATA storage devices
  • 6 x USB 3.1 / 2.0 ports
  • Optional Wi-Fi/BT + LTE/5G modem
  • Optional isolated serial + GPIO ports
  • 9V-42V DC power input
  • Side/bottom VESA / DIN Rail mounting
  • Rugged, MIL-STD-810G
  • 133 x 100 x 34 mm
  • 5-year warranty
fitlet3

Compact and capable

Just under 133mm x 100mm x 35mm, with advanced heat transfer and dissipation from internal components.

Rigid, durable, fanless housing for harsh environments with MIL-STD-810G standard.

Multiple interfaces

In addition to 6 USB ports, HDMI + mini DP, analog audio, COM port + GPIOs and dual 1GbE on RJ45, fitlet3 has optional FACET extension cards for additional interfaces:

  • Dual COM ports (RS-232 / RS-485)
  • Dual CAN bus
  • Dual 1GbE on RJ45
  • 1GbE on RJ45 with PoE device capabilities
  • 1GbE on SFP+ for optical LAN

Fully compatible with industrial applications

fitlet3 is a perfect fit for most industrial IoT gateway and industrial computer needs:

  • Thanks to rigorous component selection and high-quality mechanical design, fitlet3 can work flawlessly and continuously in harsh industrial environments with ambient temperatures of -40°C to +85°C.
  • In addition to the optional interfaces on the FACET modules, fitlet3 is equipped with a terminal block with RS-232 or RS-485 full/half duplex and 2+2 GPI and GPO interfaces.

Ready for AI

fitlet3 was designed with exceptional care for Edge-AI applications.

With enhanced heat dissipation and a high-speed interface for up to two Hailo-8 AI acceleration modules, fitlet3 is a strong Edge-AI computer with up to 52 TOPS.

Hailo-8 was tested and verified on fitlet3 with up to four video streams (1080p, 30fps) simultaneously for AI inference.

One or two Hailo-8 AI accelerators can be pre-installed on fitlet3 for a ready-to-go Edge-AI computer. 

Additional enclosure possibilities

fitlet3 has two additional enclosure variants to make it suitable wherever needed:

Deep bottom cover for a 2.5" storage device:

To allow use of a standard 2.5″ SSD or HDD with a SATA interface, the underside of the enclosure can be lowered to allow the necessary space.

Industrial top cover for conduction heat dissipation: 

fitlet3 can be thermally coupled to a heat conductive surface such as a metal cabinet by using the flat top cover, enabling heat to be transferred away from the device.

The added value

Long-term availability with an extra-long warranty

C-LAB’s fanless industrial computers are guaranteed to be available for at least 15 years from platform

launch. With this longevity, you can count on us for the long run.

Proud of our products, we provide a 5-year warranty as standard, reinforcing our commitment to guaranteeing quality and customer satisfaction over time.

Full-scale customisation

C-LAB offers a wide range of special customisation services so that computers can be shipped ready-to-use and according to customer’s needs:

  • SMT-level hardware configuration
  • Custom operation system imaging
  • Customised BIOS menu default options
  • Branding: custom splash screen, company logo, documentation, labelling and packaging
  • ZTP (Zero-Touch Provisioning)

Direct engineering support

From pre-sale consultations to post-sale engineering support, direct technical assistance is provided by the product’s development engineers. This streamlined support system ensures efficient and effective resolution of technical challenges, enhancing the customer’s project design flow.

Specifications

CPU

Intel Elkhart Lake x6000E Atom processor:

  • Intel Atom x6425E (4 Core | Base: 2.0 GHz, Boost: 3.0 GHz | 1.5 MB Cache | TDP: 12 W)
  • Intel Celeron J6413 (4 Core | Base: 1.8 GHz, Boost: 3.0 GHz | 1.5 MB Cache | TDP: 10 W)
  • Intel Atom x6211E (2 Core | Base: 1.3 GHz, Boost: 3.0 GHz | 1.5 MB Cache | TDP: 6 W)

Memory

Up to 32GB, SO-DIMM DDR4, up to 3200MT/s

Display

2 independent displays

HDMI 1.4b (up to 3840 x 2160 @ 30Hz)

mini-DP 1.2 (up to 4096 x 2160 @ 60Hz) Dual mode (can be daisy-chained for a third independent display in supporting monitors)

Storage

Up to 2 storage devices

On-board: 

  •  M.2 Key-M NVMe PCIe x4 or SATA, up to 2280
  •  M.2 Key-B SATA III, up to 2260 (for M.2 Key-B+M SATA module)

Optional: 2.5″ SATA SSD/HDD (requires deep bottom cover)

Networking and Wireless

LAN

On-board: 2x 1 Gbit Ethernet on RJ45

  • Optional FC3-LAN: additional 2 x 1 Gigabit Ethernet on RJ45
  • Optional FC3-POED: additional 1 x 1 Gigabit Ethernet on RJ45, with PoE for powering the fitlet3 over the Ethernet
  • Optional FC3-OPLN: additional 2 x 1 Gigabit Ethernet on SFP+ for optical LAN

Wireless LAN Wi-Fi 6E + BT 5.2

M.2 Key-E for Wi-Fi/BT module

Cellular communication LTE/4G

M.2 Key-B for LTE/5G modem
On-board Nano-SIM socket with external access

I/O

USB

2 x USB 3.1 on USB Type-A
4 x USB 2.0 on USB Type-A

Audio

On-board: Audio over HDMI and DP

Optional analog output, analog input on 3.5 mm jacks

Serial port/ GPIO / CAN bus

Optional terminal block with isolated industrial interfaces:

  • RS-232 or RS-485 full/half duplex
  • 2 x GPI (isolated digital input)
  • 2 x GPO (isolated digital output)

TPM

Trusted Platform Module

On-board: Intel PTT

Optional TPM 2.0 on a discrete module

FACET extension modules

fitlet3 has a few optional FACET extensions for additional interfaces on the side panel:

Technical Documentation

Download PDFfitlet3 Datasheet

Download PDFfitlet3 User’s Manual

For more technical information, go to C-LAB Technical Wiki

B2B Benefits

  • Direct support from the product’s hardware, software and mechanical engineers
  • Extended services – OEM branding, hardware and software customisation, software imaging
  • Product life-cycle management – revision freezing, advanced notice on engineering changes, stocking of EOL components
  • Risk-free evaluation – Order for testing during an evaluation period of up to 45 days. If the product is unsatisfactory, return it for a full refund (subject to condition of device and excluding storage devices, OS license, and shipping costs).

Contact us

Please fill out the form below and C-LAB will get in touch to assist you in configuring and ordering the device you need according to your specific business requirements.

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Project and Requirements

Project Description

It's not mandatory, but anything you can tell us about your project can help us support you more effectively, eg. What industry/sector are you in? What is the intended application? What solution are you looking for? How many units are you planning to sell? When are you intending to start deployment? What is the predicted project longevity?

Major Requirements

Performance/CPU | RAM | Storage | I/O | Networking and Wireless | Display | environment | power | mounting...

Would you like an evaluation unit?

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